Copper is ubiquitous in new energy, AI computing power and power electronics sectors, yet laser processing of copper has long posed a major challenge. When conventional infrared lasers strike copper, the absorption rate stays below 10%; most energy is reflected, resulting in unstable molten pools, severe spattering, and recurring issues such as pores and cold solder joints. The advent of green lasers is reshaping this landscape.

Laser marking can be performed on nearly all materials and various irregular surfaces with great flexibility, catering to diverse and complex requirements. For automotive parts, electronic products and other items that demand high quality and durability, laser marking is an ideal option with high quality and long-lasting marks.

No universal laser cutting head exists. Processing scenarios impose vastly different requirements on optical path structure, nozzle layout, follow-up precision and protective performance. For most manufacturers, issues including unstable cutting, scrapped special-shaped workpieces, uneven bevels, piercing deformation during pipe cutting and directional laser reflection rarely stem from insufficient laser power. Instead, they are mainly caused by mismatched cutting heads for specific processing applications.